Quiznetik
Computer Architecture | Set 5
1. The bit present in the op code, indicating which of the operands is the source is called as
A. src bit
B. indirection bit
C. direction bit
D. frm bit
Correct : C. direction bit
2. The instruction used to cause unconditional jump is
A. ujg
B. jg
C. jmp
D. goto
Correct : C. jmp
3. instruction is used to check the bit of the condition flags.
A. test
B. tb
C. check
D. bt
Correct : D. bt
4. .data directive is used
A. to indicate the ending of the data section
B. to indicate the beginning of the data section
C. to declare all the source operands
D. to initialize the operands
Correct : B. to indicate the beginning of the data section
5. The instruction used to multiply operands yielding a double integer outcome is
A. mul
B. imul
C. dmul
D. emul
Correct : B. imul
6. SIMD stands for
A. single instruction multiple data
B. simple instruction multiple decoding
C. sequential instruction multiple decoding
D. system information mutable data
Correct : A. single instruction multiple data
7. In case of multimedia extension instructions, the pixels are encoded into a data item of
A. 16 bit
B. 32 bit
C. 24 bit
D. 8 bit
Correct : D. 8 bit
8. The MMX (Multimedia Extension) operands are stored in
A. general purpose registers
B. banked registers
C. float point registers
D. graphic registers
Correct : C. float point registers
9. The division operation in IA-32 is a single operand instruction so it is assumed that
A. the divisor is stored in the eax register
B. the dividend is stored in the eac register
C. the divisor is stored in the accumulator
D. the dividend is stored in the accumulator
Correct : A. the divisor is stored in the eax register
10. Any condition that causes a processor to stall is called as
A. hazard
B. page fault
C. system error
D. none of the mentioned
Correct : A. hazard
11. The stalling of the processor due to the unavailability of the instructions is called as
A. control hazard
B. structural hazard
C. input hazard
D. none of the mentioned
Correct : A. control hazard
12. The contention for the usage of a hardware device is called
A. structural hazard
B. stalk
C. deadlock
D. none of the mentioned
Correct : A. structural hazard
13. The pipeline bubbling is a method used to prevent data hazard and structural hazards.
A. true
B. false
Correct : A. true
14. method is used in centralized systems to perform out of order execution.
A. scorecard
B. score boarding
C. optimizing
D. redundancy
Correct : B. score boarding
15. The algorithm followed in most of the systems to perform out of order execution is
A. tomasulo algorithm
B. score carding
C. reader-writer algorithm
D. none of the mentioned
Correct : A. tomasulo algorithm
16. The problem where process concurrency becomes an issue is called as
A. philosophers problem
B. bakery problem
C. bankers problem
D. reader-writer problem
Correct : D. reader-writer problem
17. The set of loosely connected computers are called as
A. lan
B. wan
C. workstation
D. cluster
Correct : D. cluster
18. Each computer in a cluster is connected using
A. utp
B. rj-45
C. stp
D. coaxial cable
Correct : B. rj-45
19. The computer cluster architecture emerged as a result of
A. isa
B. workstation
C. super computers
D. distributed systems
Correct : D. distributed systems
20. The software which governs the group of computers is
A. driver rd45
B. interface ui
C. clustering middleware
D. distributor
Correct : C. clustering middleware
21. The cluster formation in which the work is divided equally among the systems is
A. load-configuration
B. load-division
C. light head
D. both load-configuration and load- division
Correct : A. load-configuration
22. In the client server model of the cluster approach is used.
A. load configuration
B. fifo
C. bankers algorithm
D. round robin
Correct : D. round robin
23. The most common modes of communication in clusters are
A. message queues
B. message passing interface
C. pvm
D. both message passing interface and pvm
Correct : D. both message passing interface and pvm
24. The method followed in case of node failure, wherein the node gets disabled is
A. stonith
B. fibre channel
C. fencing
D. none of the mentioned
Correct : A. stonith
25. VLIW stands for?
A. very long instruction word
B. very long instruction width
C. very large instruction word
D. very long instruction width
Correct : A. very long instruction word
26. The main difference between the VLIW and the other approaches to improve performance is
A. cost effectiveness
B. increase in performance
C. lack of complex hardware design
D. all of the mentioned
Correct : C. lack of complex hardware design
27. In VLIW the decision for the order of execution of the instructions depends on the program itself.
A. true
B. false
Correct : A. true
28. The parallel execution of operations in VLIW is done according to the schedule determined by
A. task scheduler
B. interpreter
C. compiler
D. encoder
Correct : C. compiler
29. The VLIW processors are much simpler as they do not require of
A. computational register
B. complex logic circuits
C. ssd slots
D. scheduling hardware
Correct : D. scheduling hardware
30. To compute the direction of the branch the VLIW uses
A. seekers
B. heuristics
C. direction counter
D. compass
Correct : B. heuristics
31. EPIC stands for?
A. explicitly parallel instruction computing
B. external peripheral integrating component
C. external parallel instruction computing
D. none of the mentioned
Correct : A. explicitly parallel instruction computing
32. The duration between the read and the mfc signal is
A. access time
B. latency
C. delay
D. cycle time
Correct : A. access time
33. The minimum time delay between two successive memory read operations is
A. cycle time
B. latency
C. delay
D. none of the mentioned
Correct : A. cycle time
34. is the bottleneck, when it comes computer performance.
A. memory access time
B. memory cycle time
C. delay
D. latency
Correct : B. memory cycle time
35. The logical addresses generated by the cpu are mapped onto physical memory by
A. relocation register
B. tlb
C. mmu
D. none of the mentioned
Correct : C. mmu
36. VLSI stands for
A. very large scale integration
B. very large stand-alone integration
C. volatile layer system interface
D. none of the mentioned
Correct : A. very large scale integration
37. The cells in a row are connected to a common line called
A. work line
B. word line
C. length line
D. principle diagonal
Correct : B. word line
38. The cells in each column are connected to
A. word line
B. data line
C. read line
D. sense/ write line
Correct : D. sense/ write line
39. The word line is driven by the
A. chip select
B. address decoder
C. data line
D. control line
Correct : B. address decoder
40. A 16 X 8 Organisation of memory cells, can store upto
A. 256 bits
B. 1024 bits
C. 512 bits
D. 128 bits
Correct : D. 128 bits
41. A memory organisation that can hold upto 1024 bits and has a minimum of 10 address lines can be organized into
A. 128 x 8
B. 256 x 4
C. 512 x 2
D. 1024 x 1
Correct : D. 1024 x 1
42. Circuits that can hold their state as long as power is applied is
A. dynamic memory
B. static memory
C. register
D. cache
Correct : B. static memory
43. The number of external connections required in 16 X 8 memory organisation is
A. 14
B. 19
C. 15
D. 12
Correct : A. 14
44. The advantage of CMOS SRAM over the transistor one’s is
A. low cost
B. high efficiency
C. high durability
D. low power consumption
Correct : D. low power consumption
45. In a 4M-bit chip organisation has a total of 19 external connections.then it has address if 8 data lines are there.
A. 10
B. 8
C. 9
D. 12
Correct : C. 9
46. The Reason for the disregarding of the SRAM’s is
A. low efficiency
B. high power consumption
C. high cost
D. all of the mentioned
Correct : C. high cost
47. The disadvantage of DRAM over SRAM is/are
A. lower data storage capacities
B. higher heat dissipation
C. the cells are not static
D. all of the mentioned
Correct : C. the cells are not static
48. The reason for the cells to lose their state over time is
A. the lower voltage levels
B. usage of capacitors to store the charge
C. use of shift registers
D. none of the mentioned
Correct : B. usage of capacitors to store the charge
49. The capacitors lose the charge over time due to
A. the leakage resistance of the capacitor
B. the small current in the transistor after being turned on
C. the defect of the capacitor
D. none of the mentioned
Correct : A. the leakage resistance of the capacitor
50. circuit is used to restore the capacitor value.
A. sense amplify
B. signal amplifier
C. delta modulator
D. none of the mentioned
Correct : A. sense amplify
51. To reduce the number of external connections required, we make use of
A. de-multiplexer
B. multiplexer
C. encoder
D. decoder
Correct : B. multiplexer
52. The processor must take into account the delay in accessing the memory location, such memories are called
A. delay integrated
B. asynchronous memories
C. synchronous memories
D. isochronous memories
Correct : B. asynchronous memories
53. To get the row address of the required data is enabled.
A. cas
B. ras
C. cs
D. sense/write
Correct : B. ras
54. In order to read multiple bytes of a row at the same time, we make use of
A. latch
B. shift register
C. cache
D. memory extension
Correct : A. latch
55. The block transfer capability of the DRAM is called
A. burst mode
B. block mode
C. fast page mode
D. fast frame mode
Correct : C. fast page mode
56. The difference between DRAM’s and SDRAM’s is/are
A. the dram’s will not use the master slave relationship in data transfer
B. the sdram’s make use of clock
C. the sdram’s are more power efficient
D. none of the mentioned
Correct : D. none of the mentioned
57. The difference in the address and data connection between DRAM’s and SDRAM’s is
A. the usage of more number of pins in sdram’s
B. the requirement of more address lines in sdram’s
C. the usage of a buffer in sdram’s
D. none of the mentioned
Correct : C. the usage of a buffer in sdram’s
58. A is used to restore the contents of the cells.
A. sense amplifier
B. refresh counter
C. restorer
D. none of the mentioned
Correct : B. refresh counter
59. The mode register is used to
A. select the row or column data transfer mode
B. select the mode of operation
C. select mode of storing the data
D. all of the mentioned
Correct : B. select the mode of operation
60. In a SDRAM each row is refreshed every 64ms.
A. true
B. false
Correct : A. true
61. DDR SDRAM’s perform faster data transfer by
A. integrating the hardware
B. transferring on both edges
C. improving the clock speeds
D. increasing the bandwidth
Correct : B. transferring on both edges
62. To improve the data retrieval rate
A. access time
B. cycle time
C. memory latency
D. none of the mentioned
Correct : C. memory latency
63. In SDRAM’s buffers are used to store data that is read or written.
A. true
B. false
Correct : A. true
64. The SDRAM performs operation on the
A. rising edge of the clock
B. falling edge of the clock
C. middle state of the clock
D. transition state of the clock
Correct : A. rising edge of the clock
65. The chip can be disabled or cut off from an external connection using
A. chip select
B. lock
C. acpt
D. reset
Correct : A. chip select
66. To organise large memory chips we make use of
A. integrated chips
B. upgraded hardware
C. memory modules
D. none of the mentioned
Correct : C. memory modules
67. The less space consideration as lead to the development of (for large memories).
A. simm’s
B. dims’s
C. sram’s
D. both simm’s and dims’s
Correct : D. both simm’s and dims’s
68. The SRAM’s are basically used as
A. registers
B. caches
C. tlb
D. buffer
Correct : B. caches
69. The higher order bits of the address are used to
A. specify the row address
B. specify the column address
C. input the cs
D. none of the mentioned
Correct : A. specify the row address
70. The address lines multiplexing is done using
A. mmu
B. memory controller unit
C. page table
D. overlay generator
Correct : B. memory controller unit
71. The controller multiplexes the addresses after getting the signal.
A. intr
B. ack
C. reset
D. request
Correct : D. request
72. The RAS and CAS signals are provided by the
A. mode register
B. cs
C. memory controller
D. none of the mentioned
Correct : C. memory controller
73. When DRAM’s are used to build a complex large memory, then the controller only provides the refresh counter.
A. true
B. false
Correct : A. true
74. RAMBUS is better than the other memory chips in terms of
A. efficiency
B. speed of operation
C. wider bandwidth
D. all of the mentioned
Correct : B. speed of operation
75. The key feature of the RAMBUS tech is
A. greater memory utilisation
B. efficiency
C. speed of transfer
D. none of the mentioned
Correct : C. speed of transfer
76. The increase in operation speed is done by
A. reducing the reference voltage
B. increasing the clk frequency
C. using enhanced hardware
D. none of the mentioned
Correct : A. reducing the reference voltage
77. The data is transferred over the RAMBUS as
A. packets
B. blocks
C. swing voltages
D. bits
Correct : C. swing voltages
78. The type of signaling used in RAMBUS is
A. clk signaling
B. differential signaling
C. integral signaling
D. none of the mentioned
Correct : B. differential signaling
79. The special communication used in RAMBUS are
A. rambus channel
B. d-link
C. dial-up
D. none of the mentioned
Correct : A. rambus channel
80. The original design of the RAMBUS required for data lines.
A. 4
B. 6
C. 8
D. 9
Correct : D. 9
81. The RAMBUS requires specially designed memory chips similar to
A. sram
B. sdram
C. dram
D. ddrram
Correct : C. dram
82. A RAMBUS which has 18 data lines is called as
A. extended rambus
B. direct rambus
C. multiple rambus
D. indirect rambus
Correct : B. direct rambus
83. The RDRAM chips assembled into larger memory modules called
A. rrim
B. dimm
C. simm
D. all of the mentioned
Correct : A. rrim
84. If the transistor gate is closed, then the ROM stores a value of 1.
A. true
B. false
Correct : B. false
85. PROM stands for
A. programmable read only memory
B. pre-fed read only memory
C. pre-required read only memory
D. programmed read only memory
Correct : A. programmable read only memory
86. The PROM is more effective than ROM chips in regard to
A. cost
B. memory management
C. speed of operation
D. both cost and speed of operation
Correct : D. both cost and speed of operation
87. The difference between the EPROM and ROM circuitry is
A. the usage of mosfet’s over transistors
B. the usage of jfet’s over transistors
C. the usage of an extra transistor
D. none of the mentioned
Correct : C. the usage of an extra transistor
88. The ROM chips are mainly used to store
A. system files
B. root directories
C. boot files
D. driver files
Correct : C. boot files
89. The contents of the EPROM are erased by
A. overcharging the chip
B. exposing the chip to uv rays
C. exposing the chip to ir rays
D. discharging the chip
Correct : B. exposing the chip to uv rays
90. The disadvantage of the EPROM chip is
A. the high cost factor
B. the low efficiency
C. the low speed of operation
D. the need to remove the chip physically to reprogram it
Correct : D. the need to remove the chip physically to reprogram it
91. EEPROM stands for Electrically Erasable Programmable Read Only Memory.
A. true
B. false
Correct : A. true
92. The memory devices which are similar to EEPROM but differ in the cost effectiveness is
A. memory sticks
B. blue-ray devices
C. flash memory
D. cmos
Correct : C. flash memory
93. The only difference between the EEPROM and flash memory is that the latter doesn’t allow bulk data to be written.
A. true
B. false
Correct : A. true
94. The flash memories find application in
A. super computers
B. mainframe systems
C. distributed systems
D. portable devices
Correct : D. portable devices
95. The flash memory modules designed to replace the functioning of a hard disk is
A. rimm
B. flash drives
C. fimm
D. dimm
Correct : B. flash drives
96. The reason for the fast operating speeds of the flash drives is
A. the absence of any movable parts
B. the integrated electronic hardware
C. the improved bandwidth connection
D. all of the mentioned
Correct : A. the absence of any movable parts
97. The standard SRAM chips are costly as
A. they use highly advanced micro- electronic devices
B. they house 6 transistor per chip
C. they require specially designed pcb’s
D. none of the mentioned
Correct : B. they house 6 transistor per chip
98. The drawback of building a large memory with DRAM is
A. the large cost factor
B. the inefficient memory organisation
C. the slow speed of operation
D. all of the mentioned
Correct : C. the slow speed of operation
99. To overcome the slow operating speeds of the secondary memory we make use of faster flash drives.
A. true
B. false
Correct : A. true
100. The fastest data access is provided using
A. caches
B. dram’s
C. sram’s
D. registers
Correct : D. registers